Engineer R&D - Glass Core PKG - Product and Process Reliability

Be part of our team!

AT& S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT& S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.

To enhance our successful R& D Glass Core PKG Teamin Leoben, Austria, we are looking for a passionate

Engineer R& D - Product and Process Reliability

Your Responsibilities

In your role, you will drive the development and reliability enhancement of next-generation glass core substrate technologies. Working closely with material suppliers and cross-functional engineering teams, you will contribute to the design, evaluation, and qualification of innovative packaging solutions for advanced semiconductor applications. Your expertise will help ensure robust product performance, manufacturing excellence, and technology readiness for future market demands.

• Develop mechanical defect-free process for glass core substrate by working closely with materials suppliers
• Lead the reliability design, evaluation, and qualification of glass core substrate, including TGV structure and coating configuration
• Conduct reliability test plans covering thermal cycling, mechanical stress, warpage behavior, and electrical stability
• Analyze failure mechanisms such as TGV cracking, SeWaRe, and CTE-mismatch effects
• Manage cross-functional tasks and technical documentation
• Analyze experimental data and provide input and recommendations to enhance product performance and improve process efficiency

Your Profile

• Bachelor’s/Master’s in materials science, mechanical engineering, electronics packaging, or related fields
• 3+ years of experience in reliability engineering, materials reliability, or packaging/ substrate technology development
• Expertise in thermo-mechanical reliability, and failure mode analysis
• Familiarity with JEDEC/IPC standards and familiarity with stress simulation (preferred)
• Strong responsibility-driven mindset for goal achievement reliably and quickly
• Strong technical aptitude with willingness to develop problem-solving skills further
• Effective collaboration and communication skills
• Fluency in English

Our Offer

• A meaningful role with opportunities for long-term growth in an international environment
• Chance to actively contribute to AT& S´ success and to create value
• A structured and tailor-made onboarding program along with continual training opportunities
• Modern company canteen with freshly prepared meals every day
• Free parking spaces and e-charging stations
• Diverse health measures and a wide range of employee benefits

AT& S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry (https://www.feei.at/wp-content/uploads/2024/04/angestellte-2025-05-01.pdf), employment group E-F, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.

Contact

Ready for a new challenge to advance your career? It´s just a click to apply online. We look forward to your application and your detailed resume. Your AT& S Team!